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EQP ½Ã½ºÅÛÀÇ Æ¯Â¡
EQP ½Ã½ºÅÛ Operating Mode
EQP DATA
EQP MASsoft Software Operating Modes
EQP Systems for Plasma Applications in Etching-Deposition-Coating-Process Development
Other Equipments for Plasma Diagnostics
EQP DATA

Ion Energy Distribution(IED)

Parallel plate plasma chamberÀÇ RF driven
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Negatie and Positive Ion Mass Spectra
Fullerence C60À» ºÐ¼®ÇÑ mass spectra
Plasma Characterization
ÀÌ ÀÚ·á´Â O2À̿ ¿¡³ÊÁöºÐÆ÷(Ion Energy
Distributions)·Î¼­ power density 4Wcm¸¦
ÀÌ¿ëÇÑ 27.12 MHz Argon/Oxygen ÇöóÁ·Î
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5¡¿10torr(5Pa) to 1.3torr(130Pa)
·Î Áõ°¡ µÉ ¶§, EQP À̿ ¿¡³ÊÁö ºÐÆ÷
(ion energy distributions)´Â º¯È­µÇ´Â
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End Point Detection
EQP´Â reactive ion etching(R.I.E.) ¿¡¼­ °í°¨µµÀÇ end point detectorÀÌ´Ù. ÀÌ ÀÚ·á´Â
hetero junction deviceÀÇ °øÁ¤¿¡¼­ÀÇ end point detectionÀ» ³ªÅ¸³½´Ù. SiCl4 ¿¡Äª°øÁ¤ µ¿¾È mass 27¿¡¼­ °¨ÁöµÇ´Â Aluminium ion signalÀÇ ¼¼±â º¯È­(intensity change)´Â ´ÙÃþ ±¸Á¶¿¡¼­ 50¡Ê AlGaAs Ãþ°ú Á¤¹ÐÈ÷ µ¿ÀϽõȴÙ. ¿ÏÀüÇÑ ½Ä°¢ÀÌ ¸í¹éÇÏ°Ô µÈ °ÍÀ» ¾Ë ¼ö ÀÖ´Ù. Á¦Á¶¿¡ ÀÖ¾î ½Ä°¢Àº ÃÖÀûÀÇend point¿¡¼­ Á¾°áµÈ´Ù.
Time Resolved Mass and Energy Spectra for After glow, Pulsed Plasma and Laser Ablation Studies.
EQP½Ã½ºÅÛÀº µ¥ÀÌÅÍ ¼öÁýÀÇ ÅëÁ¦¸¦ °¡´ÉÇÏ°Ô ÇÏ´Â signal gting facility¸¦ °¡Áö°í ÀÖ´Ù. ´ÜÁö 1 ¸¶ÀÌÅ©·Î ÃÊ ¸¸Å­ ªÀº ƯÁ¤ ½Ã°£ â¿¡¼­ Áú·®°ú ¿¡³ÊÁöÀÇ ½ºÆåÆ®·³À» ¾òÀ» ¼ö ÀÖ´Ù.
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