Hiden»çÀÇ EQP ÇöóÁÁø´Ü½Ã½ºÅÛ
EQP ½Ã½ºÅÛÀÇ Æ¯Â¡
EQP ½Ã½ºÅÛ Operating Mode
EQP DATA
EQP MASsoft Software Operating Modes
EQP Systems for Plasma Applications in Etching-Deposition-Coating-Process Development
Other Equipments for Plasma Diagnostics
EQP ½Ã½ºÅÛÀÇ Æ¯Â¡
Hiden EQP ½Ã½ºÅÛÀº ƯÁ¤ À̿ ¿¡³ÊÁö¿¡¼­ÀÇ mass spectra¿Í ¼±ÅÃµÈ ÇöóÁ ÀÌ¿ÂÀÇ À̿ ¿¡³ÊÁö ºÐÆ÷¸¦ ¾òÀ» ¼ö ÀÖ´Â ³ôÀº Åõ°ú À̿¿¡³ÊÁö ºÐ¼®±â¿Í »çÁß ±ØÀÚ Áú·®ºÐ¼®±â°¡ °áÇÕµÈ ÇÑ ´Ü°è ¹ßÀüµÈ ÇöóÁ Áø´Ü µµ±¸ÀÌ´Ù. ¾Õ¼± ±â¼úÀÇ EQP ionizer´Â Áß¼º¹°Áú°ú ¶óµðÄ®À» °ËÃâ °¡´ÉÄÉ Çϰí, À½ÀüÇÏÀÇ ÇöóÁ È­Çкоß(electronegative plasma chemistries)¿¡¼­ ¶óµðÄ®¿¡ ´ëÇÑ °ËÃâ ´É·Â(detection capability)À» º¸´Ù Çâ»ó½ÃŲ ÀüÀÚ ºÎÂø ÀÌ¿ÂÈ­ ¹æ½Ä (electron attachement ionization feature, electron attachment mass spectrometry)À» Á¦°øÇÑ´Ù.
High Sensitivity
À̿µé, Áß¼º¹°Áú°ú ¶óµðÄ®ÀÇ ppm ÀÌÇÏÀÇ ´ÜÀ§¿¡¼­ °ËÃâ.
Ion Energy Analysis
ÇöóÁ À̿µ鿡 ´ëÇÑ À̿¿¡³ÊÁö ºÐÆ÷¸¦ ¼öÃʳ»¿¡ ¾òÀ» ¼ö ÀÖÀ¸¸ç, 100eV¿Í 1000eV ¿¡³ÊÁö ¹üÀ§ÀÇ ¸ðµ¨ÀÌ Á¦°øµÈ´Ù.
Afterglow, Pulsed Plasma, and Laser Ablation
Ç¥ÁØ TTL signal gating inputÀº time resolved ¿¬±¸¿¡ Æ÷ÇԵȴÙ. 1 ¸¶ÀÌÅ©·ÎÃʸ¸Å­ ªÀº ½Ã°£ µ¿¾È ÇöóÁ pulses¿Í ÇöóÁ plumes ºÐ¼®ÀÌ °¡´ÉÇÏ´Ù.
Positive and Negative Ion Measurement
¹Ì¸® ¼³Á¤µÈ software Mode¿¡ ÀÇÇØ ¾çÀÌ¿Â, À½À̿°ú Áß¼º¹°Áú ºÐ¼® Mode°£ÀÇ Áï°¢ÀûÀÎ switchingÀÌ °¡´ÉÇÏ´Ù.
Neutral and Rdical Detection
EQP integral electron impact ionizer¿¡ ÀÇÇØ Áß¼º¹°Áú°ú ·¡µðÄÃÁ¾µéÀÇ ºÐ¼®ÀÌ °¡´ÉÇÏ´Ù.
Appearance Potential Spectra
EQP ÀÌ¿ÂÈ­ ÀåÄ¡´Â ¼±ÅÃµÈ Á¾µéÀÇ appearance potential spectra¿¡ ´ëÇØ ¸ðµç À̿ source º¯¼öµé- ÀüÀÚ¿¡³ÊÁö(electron energy)¸¦ Á¤È®È÷ ÆÇµ¶ÇÒ ¼ö ÀÖ´Â ÀåÄ¡ Æ÷ÇÔ- ¿¡ ´ëÇÑ Á¤¹ÐÇÑ ÅëÁ¦·Î Ư¡Áö¾îÁø´Ù. Appearance potential spectra¸¦ ÅëÇÏ¿© ÇöóÁ Áß¼º ¹°ÁúÁ¾µéÀÇ ¿©±â »óÅÂ(excitation state)¿Í ±úÁü»óÅÂ(fragmentation state)¸¦ È®ÀÎÇÒ ¼ö ÀÖ´Â Á÷Á¢ÀûÀÎ Á¤º¸¸¦ ¾òÀ» ¼ö ÀÖ´Ù.
Electron Attachment Ionization Feature
Soft ÀÌ¿ÂÈ­ÀÇ ½Å±â¼úÀº ÇöóÁ¿¡¼­ À½ÀüÇÏ(electronegative) Á¾µéÀÇ ºÐ¼®À» À§ÇØ optionÀ¸·Î¼­ Á¦°øµÇ¸ç Áß¼º¹°Áú°ú ·¡µðÄ®ÀÇ ºÐ¼®À» Á»´õ Çâ»ó ½ÃŲ´Ù.